Palladium Solution

Palladium plating is used in conjunction with other metal deposits such as Rhodium as the intermediate layer improves adhesion as well as acting like a barrier to prevent copper migration.

• Palladium plating
• Very high thickness uniformity make it a unique product
• Contains 2g of palladium per litre
• Plates up to 0.2 micron
• Ready to use solution
• Nickel, lead, and cadmium free
• 1 Litre
• See technical & commercial sheets in the "document" link above

The characteristics of compactness and resistance also make this solution particularly suitablefor use as an intermediate layer between white gold and rhodium, considerably reducing the possibility of scratches and abrasion of the rhodium-plated layer affecting the alloy below. This condition is very important for preventing release onto the skin of part of a white gold alloy containing nickel.